Journal of Welding and Joining

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27 Articles

Thermal Cycling Performance of Heterogeneous Solder Ball Joints with Sn-3.0Ag-0.5Cu and Sn-0.75Cu(-Ni,Bi) Solder Ball Composition for BGA Package: Joo Young Bae, Mi-Song Kim, So-Hee Hyun et al.; J Weld Join. 2024;42(2):174-183. Published online April 30, 2024; DOI: https://doi.org/10.5781/JWJ.2024.42.2.4; PDF

Electrochemical Metallic Ion Migration Property of Multi-Layer Ceramic Capacitor for Car Electronics: Won Sik Hong, Mi-Song Kim, Joo Young Bae et al.; J Weld Join. 2023;41(6):519-527. Published online December 31, 2023; DOI: https://doi.org/10.5781/JWJ.2023.41.6.11; Full text PubReader ePub PDF

Bonding Characteristics of Solder and Sinter Joints on Active-Metal-Brazing Substrates with Nano Sputtered Ag-Cu-Ti Brazing Filler Metal: Mi-Song Kim, Won Sik Hong, Yong-Mo Kim; J Weld Join. 2023;41(6):558-565. Published online December 31, 2023; DOI: https://doi.org/10.5781/JWJ.2023.41.6.15; Full text PubReader ePub PDF

Bonding Property of Middle Temperature Sn-Ag-Cu Solder Ball Joint of Ball Grid Array Package: Joo Young Bae, Mi-Song Kim, Hye Min Lee et al.; J Weld Join. 2023;41(5):379-386. Published online October 31, 2023; DOI: https://doi.org/10.5781/JWJ.2023.41.5.8; Full text PubReader ePub PDF

Bonding Property of Flip-Chip Chip-Scale Package with Vacuum Reflow and Thermal Compression Bonding Processes: So-Hee Hyun, Hye Min Lee, Mi-Song Kim, Won Sik Hong; J Weld Join. 2023;41(5):387-395. Published online October 31, 2023; DOI: https://doi.org/10.5781/JWJ.2023.41.5.9; Full text PubReader ePub PDF

Solder Joint Degradation and Electrochemical Metallic Ion Migration Property of Solder Joints with Surface Finish: Hye Min Lee, Mi-Song Kim, Won Sik Hong; J Weld Join. 2023;41(4):265-274. Published online August 31, 2023; DOI: https://doi.org/10.5781/JWJ.2023.41.4.5
Cited By 1; Full text PubReader ePub PDF

Effects of Solder Powder Particle Size and Substrate Surface Finish on Degradation Properties of Solder Joints: Mi-Song Kim, Won Sik Hong, Hye-Min Lee, Myeongin Kim; J Weld Join. 2022;40(3):207-214. Published online June 20, 2022; DOI: https://doi.org/10.5781/JWJ.2022.40.3.1
Cited By 1; Full text PubReader ePub PDF

Intermetallic Compound Growth Induced by Electromigration in Sn-2.5Ag Solder Joints with ENEPIG Surface Finish: Jieun Yu, Sujong Kim, Won Sik Hong, Namhyun Kang; J Weld Join. 2022;40(3):225-232. Published online June 24, 2022; DOI: https://doi.org/10.5781/JWJ.2022.40.3.3
Cited By 4; Full text PubReader ePub PDF

Laser Soldering Process Optimization of MEMS Probe of Probe Card for Semiconductor Wafer Test: Myeongin Kim, Won Sik Hong, Mi-Song Kim; J Weld Join. 2022;40(3):271-277. Published online June 2, 2022; DOI: https://doi.org/10.5781/JWJ.2022.40.3.9; Full text PubReader ePub PDF

Optimization of FC-CSP and MLCC Soldering Process Using Type 7 Solder Paste: Hye-Min Lee, Mi-Song Kim, Myeongin Kim, Won Sik Hong; J Weld Join. 2022;40(2):165-174. Published online April 21, 2022; DOI: https://doi.org/10.5781/JWJ.2022.40.2.8
Cited By 3; Full text PubReader ePub PDF

Microstructural Evolution of Cantilever Wire Probe after Touch-Down Fatigue Cycles for Power Semi-Conductor Wafer Testing: Won Sik Hong, Mi-Song Kim, Myeongin Kim; J Weld Join. 2021;39(6):677-683. Published online December 6, 2021; DOI: https://doi.org/10.5781/JWJ.2021.39.6.13; Full text PubReader ePub PDF

Ultrasonic Bonding Interface Degradation Characteristics of Gold-Coated Silver Wire for Semiconductor Packaging: Mi-Song Kim, Won Sik Hong, Sang Yeop Kim, Sung Min Jeon, Jeong Tak Moon; J Weld Join. 2021;39(4):343-348. Published online August 11, 2021; DOI: https://doi.org/10.5781/JWJ.2021.39.4.1
Cited By 3; Full text PubReader ePub PDF

MLCC Solder Joint Property with Vacuum and Hot Air Reflow Soldering Processes: Won Sik Hong, Mi-Song KIm, Myeongin Kim; J Weld Join. 2021;39(4):349-358. Published online August 11, 2021; DOI: https://doi.org/10.5781/JWJ.2021.39.4.2
Cited By 6; Full text PubReader ePub PDF

Flip Chip - Chip Scale Package Bonding Technology with Type 7 Solder Paste Printing: Mi-Song Kim, Won Sik Hong, Myeongin Kim; J Weld Join. 2021;39(4):359-367. Published online August 23, 2021; DOI: https://doi.org/10.5781/JWJ.2021.39.4.3
Cited By 11; Full text PubReader ePub PDF

Laser Soldering Properties of MEMS Probe for Semiconductor Water Testing: Won Sik Hong, Mi-Song Kim, Myeongin Kim, Sang-Hyuk Yun, Yunhwi Park; J Weld Join. 2021;39(4):368-375. Published online August 26, 2021; DOI: https://doi.org/10.5781/JWJ.2021.39.4.4
Cited By 2; Full text PubReader ePub PDF

Pressureless Silver Sintering Property of SiC Device and ZTA AMB Substrate for Power Module: Mi-Song Kim, Chulmin Oh, Won Sik Hong; J Weld Join. 2019;37(2):15-20. Published online April 19, 2019; DOI: https://doi.org/10.5781/JWJ.2019.37.2.3
Cited By 8; Full text PubReader ePub PDF

Effect of Air-HAST Conditions on Sn Whisker Growth: Chulmin Oh, Sangjoo Oh, Dajung Kim, Won Sik Hong, Keun-Soo kIM; J Weld Join. 2019;37(2):21-25. Published online April 22, 2019; DOI: https://doi.org/10.5781/JWJ.2019.37.2.4; Full text PubReader ePub PDF

Ultrasonic Bonding Property of Aluminum Wire for Power Conversion Module of Automotive: Ji-Yeon Park, Chulmin Oh, Deok-Hee Won, Won Sik Hong; J Weld Join. 2018;36(3):57-64. Published online June 12, 2018; DOI: https://doi.org/10.5781/JWJ.2018.36.3.9
Cited By 4; Full text PubReader ePub PDF

Effects of High Temperature-moisture on Corrosion and Mechanical Properties for Sn-system Solder Joints: Jeonga Kim, Yujin Park, Chul Min Oh et al.; J Weld Join. 2017;35(3):7-14. Published online June 30, 2017; DOI: https://doi.org/10.5781/JWJ.2017.35.3.2; Full text PubReader ePub PDF

Cu Corrosion Test Method for Lead-Free Solders: Mi-Song Kim, Won Sik Hong, Chul Min Oh, Keun-Soo Kim; J Weld Join. 2017;35(3):21-27. Published online June 30, 2017; DOI: https://doi.org/10.5781/JWJ.2017.35.3.4; Full text PubReader ePub PDF

Validation of sequence test method of Pb-free solder joint for automotive electronics: A Young Kim, Chul Min Oh, Won Sik Hong; J Weld Join. 2015;33(3):25-31. Published online June 30, 2015; DOI: https://doi.org/10.5781/JWJ.2015.33.3.25; PDF

Degradation Behavior of Eutectic and Pb-free Solder Plated Ribbon in Crystalline Silicon Photovoltaic Module: Ju-Hee Kim, A Yong Kim, Nochang Park, Jeong Won Ha, Sang Guon Lee, Won Sik Hong; J Weld Join. 2014;32(6):611-617. Published online December 31, 2014; DOI: https://doi.org/10.5781/JWJ.2014.32.6.75; PDF

Degradation Characteristics of Eutectic and Pb-free Solder Joint of Electronics mounted for Automotive Engine: A Young Kim, Won Sik Hong; J Weld Join. 2014;32(3):288-294. Published online June 30, 2014; DOI: https://doi.org/10.5781/JWJ.2014.32.3.74
Cited By 2; PDF

Failure Mechanism of Bendable Embedded Electronic Module Under Various Environment Conditions: Yun-Seong Jo, A Young Kim, Won Sik Hong; J Weld Join. 2013;31(5):59-63. Published online November 5, 2013; DOI: https://doi.org/10.5781/KWJS.2013.31.5.59
Cited By 1; PDF

Fabrication and Reliability Test of Device Embedded Flexible Module: Dae Gon Kim, Sung Taik Hong, Deok Heung Kim, Won Sik Hong, Chang-Woo Lee; J Weld Join. 2013;31(3):84-88. Published online June 30, 2013; DOI: https://doi.org/10.5781/KWJS.2013.31.3.84
Cited By 2; PDF

Degradation Behavior of Solder Joint and Implementation Technology for Lead-free Automotive Electronics: Won Sik Hong, Chul Min Oh; J Weld Join. 2013;31(3):22-30. Published online June 30, 2013; DOI: https://doi.org/10.5781/KWJS.2013.31.3.22
Cited By 9; PDF

Volume 42, No. 2

Journal of
Welding and
Joining

Print ISSN: 2466-2232
Online ISSN: 2466-2100

MOST VIEWED MOST CITED

7,768	Review on Vacuum Laser Beam Welding
4,160	A Study on Welding-induced Temperature Distribution and Deformation of IMO Type C LNG Fuel Tank Support Structures
3,905	Study on Laser Welding of Dissimilar Materials between Aluminum and Copper (Ⅰ) - Research Trend in Laser Welding Technology and Materials Testing Methods -
3,899	Optimization of FC-CSP and MLCC Soldering Process Using Type 7 Solder Paste
3,751	Recent Studies of Transient Liquid Phase Bonding Technology for Electric Vehicles

Cited By 9	Changes in the Mechanical Properties and Microstructure of High Manganese Steel by High Heat Input Welding and General Welding Processes
Cited By 7	Review on Vacuum Laser Beam Welding
Cited By 6	A Study on Welding-induced Temperature Distribution and Deformation of IMO Type C LNG Fuel Tank Support Structures
Cited By 6	Comparison of Welding Deformation Characteristics by Circumferential Welding for Austenitic and Duplex Stainless Steel Pipe : Experimental Study
Cited By 6	Development and Evaluation of Stainless Steel-Base Flux-Cored Wires for 9% Nickel Steel

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